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Tweaks for systems, rooms and Do It Yourself (DIY) help. FAQ.

Aha..found it..

Thought I was gonna leave you out in the cold..I had a lot of articles to go through..

The article is "Ultrasonic Soldering in the Electronics Industry", John Fuchs, Blackstone Ultrasonics, Jamestown, N.Y. It was in "Printed Circuit Assembly", July 1989. Pages 42-45.

Left column, page 43.

Quote

""Fluxes also act as wetting agents, reducing the contact angle between the solder and the base metal. This property leds to wicking and capillary flow which is essential for solder to penetrate into typical solder joints such as those found.....""

I stopped looking after I found this. From what I recall, I had some other papers I had read from in that time period, I can't seem to get Texas Instruments out of my thoughts re this, as I believe they elaborated moreso on the contact angle thing, including some high mag pictures. What I find more interesting is that I remembered that from '89, but can't remember which days are trash days..duh..

I can scan the article if you're interested, but methinks you don't want to embark on U/S soldering techniques..and I'm sure you already understand the bulk of the article.

Cheers, John



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  • Aha..found it.. - jneutron 07:40:59 11/07/05 (1)


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