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John Curl & Thorsten; Re: Solder

206.173.186.134

Posted by Dave B on July 6, 1999 at 18:32:41

In the world of thick film hybrid microelectronics a recent published set of data on the use of Lead free solders for long term aged adhesion of components to thick film silver conductors shows DRAMATIC improvement with the use of 95Sn/4.5Ag/0.5Cu vs. 62Sn/36Pb/2Ag

62/36/2 was(is) the industry staple for a very long time and now with the advent of CASTIN(Cu,Ag,Sb,Sn) a few years ago and it's step forward in improvement and now the improved ternary lead free solders, I'm not surprised that there may be an audible difference.

My own work 10 years ago on tin diffusion upon aging of solder joints convinced me that all was not right in solderland. I was using an Amray SEM and a Kevex detector and comparing aged 62/36/2 solder joints to thick film conductors to unaged ones and metal mapping Sn, Pb, Ag & Pd. It was clear that the tin was VERY mobile and the lead was oxidizing very badly.

95/4.5/0.5 is near eutectic with a 1 degree C plastic range 215 to 216 and a liquidus at 217C. I'll have some of this solder the end of this week, I'll let you know what I find.

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